Semiconductor component and method
US7709887B2 · kind B2 · utility
5Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2006 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Apr 13, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor component and method of making a semiconductor component is disclosed. In one embodiment, the semiconductor component includes a drift region of a first conductivity type, a body region of a second conductivity type, and a trench extending into the body region. A semiconductor region of the first conductivity type is in contact with the drift region and the body region and is arranged at a distance from the trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.