ATM bonding
US7710979B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2004 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Feb 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L2012/5624
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
There is provided an apparatus and method for ATM bonding. The apparatus comprises a first unit having a first xDSL line connected thereto, a second unit having a second xDSL line connected thereto and a connection between the first unit and the second unit. The first unit is arranged to convert one incoming ATM datastream to a plurality of data and to convert a plurality of incoming data to one ATM data stream. The first unit is arranged to implement the ATM bonding layer of the ATM protocol. The second unit may be arranged to implement one or more of the higher layers. The method comprises the steps of: a first unit receiving an ATM data stream; the first unit converting the ATM data stream into a plurality of data; the first unit transmitting a first one of the plurality of data over a first xDSL line connected to the first unit; the first unit sending a second one of the plurality of data to a second unit via a connection; and the second unit transmitting the second one of the plurality of data over a second xDSL line connected to the second unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.