Geiger mode avalanche photodiode
US7714292B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2007 |
| Grant date | May 11, 2010 |
| Priority date | — |
| Expiry date | Jan 31, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/199
Abstract
A avalanche mode photodiode array (102) is fabricated using a silicon on insulator wafer and substrate transfer process. The array includes a plurality of photodiodes (100). The photodiodes (100) include an electrically insulative layer (206), a depletion region (204), and first (208) and second (210) doped regions. An interconnection layer (212) includes electrodes (214, 216) which provides electrical connections to the photodiodes. The photodiode array (102) is carried by a handle wafer (217).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.