Patent · US Active

Leadframe panel

US7714418B2 · kind B2 · utility

54Cited by

6References

20Claims

0Family size

Assignee

NATIONAL SEMICONDUCTOR CORPORATION · US

Inventors

Peng-Soon Lim · Kluang, MY
Terh Kuen Yii · Melaka City, MY
Mohd Sabri Bin Mohamad Zin · Melaka City, MY
Ken Pham · San Jose, US

Key dates

Filing date	Jul 23, 2007
Grant date	May 11, 2010
Priority date	—
Expiry date	Sep 28, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/14
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An improved leadframe panel suitable for use in packaging IC dice is described. The described leadframe panel is configured such that the amount of leadframe material that is removed during singulation of the leadframe panel is reduced.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.