Patent · US Active

Ball grid array package format layers and structure

US7714426B1 · kind B1 · utility

1Cited by
29References
29Claims
0Family size

Inventors

Key dates

Filing dateJul 7, 2007
Grant dateMay 11, 2010
Priority date—
Expiry dateJul 7, 2027

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3011
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded together to form a stack of layers. The leads on the access plane are interconnected among layers to form a high-density electronic package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.