Patent · US Active

Chip module and method for producing a chip module

US7714454B2 · kind B2 · utility

2Cited by

9References

11Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Andreas Mueller-Hipper · Regensburg, DE
Frank Pueschner · Kelheim, DE

Key dates

Filing date	Dec 19, 2007
Grant date	May 11, 2010
Priority date	—
Expiry date	Jan 30, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/48091
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A chip module comprises a substrate, a chip arranged on one side of the substrate and conductor structures arranged on at least one side of the substrate and conductively connected to the chip. At least one stiffening element is arranged on one side of the substrate and a moulding cap encapsulates at least the chip. For producing the chip module, provision is made for providing a substrate and applying conductor structures to at least one side of the substrate. At least one stiffening element is mounted onto one side of the substrate. Furthermore, a chip is mounted onto one side of the substrate and connected to the conductor structures. A moulding compound is applied on the substrate, such that the chip is covered.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.