Patent · US Active

Method and device for applying a solder to a substrate

US7717316B2 · kind B2 · utility

4Cited by

3References

10Claims

0Family size

Assignee

Pac Tech—Packaging Technologies Gmbh · DE

Inventors

Ghassem Azdasht · Berlin, DE
Lars Titerle · Berlin, DE

Key dates

Filing date	Apr 18, 2007
Grant date	May 18, 2010
Priority date	—
Expiry date	Jan 14, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/086
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for applying a solder to a substrate by positioning solder in a solid state, melting it and then impacting it against a substrate by the action of compressed gas. The method utilizes a holder having a capillary bore whose diameter, at the substrate end, has a contraction whose diameter (D2) is smaller than the diameter (D3) of the solder globule, an energy source connected to the capillary, and a compressed gas source connected to the capillary.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.