Manufacturing method of circuit board
US7718078B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Sep 14, 2006 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Feb 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1394
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a circuit board is provided. Firstly, a substrate board having a plurality of through holes is provided. Next, a first metal layer is electro-less plated on the surface of the substrate board and the surface of the through holes. Then, a second metal layer is plated on the first metal layer. After that, the second metal layer and the first metal layer are patterned to form a patterned circuit layer. Lastly, a third metal layer is plated on the patterned circuit layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.