Substrate heat treatment apparatus
US7718925B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2006 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Sep 13, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-treating plate has, arranged on the upper surface thereof, support elements for supporting a substrate, and a first sealer for closing lateral areas of a first space formed between the heat-treating plate and the substrate supported. Further, second sealers ring-shaped in plan view are arranged around openings of perforations accommodating transfer pins. The second sealers close lateral areas of second spaces opposed to the perforations. Gastightness of the first space excluding the second spaces is never impaired through the perforations. By exhausting gas from the first space through exhaust bores, the substrate is effectively sucked for heat treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.