Method and apparatus for quickly determining the effect of placing an assist feature at a location in a layout
US7721246B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2006 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Feb 12, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/705
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
One embodiment of the present invention determines the effect of placing an assist feature at a location in a layout. During operation, the system receives a first value which was pre-computed by convolving a model with a layout at an evaluation point, wherein the model models semiconductor manufacturing processes. Next, the system determines a second value by convolving the model with an assist feature, which is assumed to be located at a first location which is in proximity to the evaluation point. The system then determines the effect of placing an assist feature using the first value and the second value. An embodiment of the present invention can be used to determine a substantially optimal location for placing an assist feature in a layout.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.