Method for manufacturing cantilever structure of probe card
US7723143B2 · kind B2 · utility
2Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2007 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Dec 17, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06727
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for manufacturing a cantilever structure of a probe card is disclosed. In accordance with the method of the present invention, a first sacrificial wafer is used as a mold to form a cantilever structure having various shapes, a microscopic pitch and a high aspect ratio. In accordance with the method of the present invention, a probe tip may be formed by using a second sacrificial substrate and a bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.