Patent · US Active

Method for producing shock and tamper resistant microelectronic devices

US7723162B2 · kind B2 · utility

7Cited by

17References

18Claims

0Family size

Assignee

White Electronic Designs Corporation · US

Inventors

Curtis Anderson · Largo, US
James A. Sangiorgi · Phoenix, US

Key dates

Filing date	Nov 19, 2007
Grant date	May 25, 2010
Priority date	—
Expiry date	Apr 11, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of producing a microelectronic device resistant to tampering, inspection and damage from surrounding environment or operating conditions includes: (i) applying an adhesion layer on a circuit including a die fixed and electrically connected to a laminate substrate; (ii) spraying, through a flame spray process, a tamper resistant coating over the applied adhesion layer; (iii) applying a first encapsulant for filling spaces and air pockets; (iv) removing air and gases from the first encapsulant; and (v) applying a second encapsulant around the first encapsulant for providing a moisture barrier 42 and handling surfaces for the microelectronic device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.