Method of forming premolded lead frame
US7723163B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2008 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | May 26, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a pre-molded lead frame having increased stand-offs includes the steps of attaching a first tape to a first side of the lead frame and a second tape to a second side of the lead frame. The taped lead frame is placed in a mold and a first flow of mold compound is initiated. The first flow of the mold compound fills a space between the first tape and an upper mold chase of the mold. A second flow of the mold compound then is initiated. The second flow of the mold compound fills the spaces between a die pad and leads of the lead frame. The first and second tapes then are removed from the lead frame. Improved stand-offs are provided because the first tape was depressed by the first flow of the mold compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.