Packaged MEMS device assembly

US7723811B2 · kind B2 · utility

Assignee

• HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. · US

Inventors

• Charles C. Haluzak · Corvallis, US
• Jeffrey R. Pollard · Corvallis, US
• Kirby Sand · Corvallis, US
• John R. Sterner · Albany, US
• Henry Kang · Fairport, US
• Chien-Hua Chen · Corvallis, US
• James Denning Smith · Albany, US

Key dates

• Filing date: May 3, 2006
• Grant date: May 25, 2010
• Expiry date: Aug 2, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.