Electronic devices having air gaps
US7723850B2 · kind B2 · utility
12Cited by
45References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2007 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Aug 13, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24628
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.