Assembly and method of assembling by soldering an object and a support
US7723854B2 · kind B2 · utility
1Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2007 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Jul 6, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This assembly of an object and a support is achieved by using solder bumps. At least two wettability areas are made respectively on an object and on a support. Each solder bump ensures electrical contact and mechanical fixing firstly to one of the wettability areas of object and secondly to one of the wettability areas of support. The melting temperature of solder bumps is lower than the melting temperature of each of the wettability areas. Each wettability area of the object forms an angle of 70° to 110° with respect to each wettability area of the support and the object and the support are mutually distant from one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.