Method for the production of a soldered joint
US7726543B2 · kind B2 · utility
0Cited by
9References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 25, 2008 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Apr 27, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/111
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece of solder material is at least partially melted off. The at least partially melted off formed piece of solder material being thrust against a bonding arrangement in such a way that both bonding partners are wetted in a bonding area to establish an electrically conductive bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.