Auxiliary electrode encased in cation exchange membrane tube for electroplating cell
US7727364B2 · kind B2 · utility
12Cited by
15References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2006 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Mar 31, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for plating a metal onto a substrate. One embodiment of the invention provides an apparatus for electrochemically plating a substrate. The apparatus comprises a fluid basin configured to retain a plating solution therein, an anode assembly disposed in the fluid basin, a substrate support member configured to support the substrate and contact the substrate electrically, and an encased auxiliary electrode assembly disposed in the fluid basin. The encased auxiliary electrode assembly generally comprises an auxiliary electrode disposed in a protective tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.