High etch resistant underlayer compositions for multilayer lithographic processes
US7727705B2 · kind B2 · utility
1Cited by
7References
18Claims
0Family size
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Key dates
| Filing date | Feb 20, 2008 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Jan 8, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/106
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An etch resistant thermally curable Underlayer for use in a multiplayer liyhographic process to produce a photolithographic bilayer coated substrate, the composition having:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.