Semiconductor device
US7727807B2 · kind B2 · utility
10Cited by
10References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 31, 2007 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Jan 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to embodiments may include an interposer, a plurality of devices stacked on the interposer, a cooling device provided in at least one of the devices and including a passage for a cooling material, and a connection electrode provided between the devices, in which the connection electrode connects a signal electrode in an upper device to a signal electrode in a lower device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.