Printed circuit board assembly having adhesive layer
US7728232B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 26, 2007 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Feb 26, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2857
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An exemplary adhesive layer includes an adhesive main body having a first adhesive surface and a second adhesive surface on an opposite side of the adhesive main body to the first adhesive surface. The adhesive main body defines a number of through-holes between the first adhesive surface and the second adhesive surface therein. The through-holes are filled with an inner adhesive that has a higher adhesion than the adhesive main body. Adhesiveness of the first adhesive surface and the second adhesive surface of the adhesive main body can be improved, thereby preventing a printed circuit board having the adhesive layer from distortion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.