Semiconductor device and method of cutting electrical fuse
US7728407B2 · kind B2 · utility
4Cited by
1References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 16, 2007 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Apr 26, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor substrate, and an electrical fuse including a first conductor including a first cutting target region, and a second conductor branched from the first conductor and connected to the first conductor and including a second cutting target region, which are formed on the semiconductor substrate, wherein a flowing-out region is formed of the first conductor flowing toward outside between the first cutting target region and the second cutting target region in a condition of cutting the electrical fuse.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.