Compressive conductors for semiconductor testing
US7728611B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 6, 2007 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Apr 16, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07314
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An interconnect assembly electrically connecting two circuit members, which include respective arrays of electrical contacts for engagement with the interconnect assembly. The interconnect assembly comprises a plurality of electrical conductors, the plurality of conductors arranged in a spaced arrangement, the spaced arrangement of the conductors substantially corresponding to a spaced arrangement for the respective arrays of electrical contacts to provide contact between the conductors and the contact arrays and a carrier, including a socket and a retainer. The socket includes a plurality of apertures each receiving an upper portion of one of the plurality of conductors and the retainer includes a plurality of apertures each receiving a lower portion of one of the plurality of conductors; and the respective apertures are aligned axially with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.