Radio frequency (RF) integrated circuit (IC) packages having characteristics suitable for mass production
US7728774B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2008 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Nov 20, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radio-frequency integrated circuit chip package with N integrated aperture-coupled patch antennas, N being at least one, includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn comprises at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein. The slots are substantially opposed to the patches. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and substantially parallel thereto, and at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, with the N generally planar patches located in the antenna cavity. Fabrication techniques are also described. In some embodiments, N is two or more and a phased array is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.