Methods and systems for identifying defect types on a wafer
US7728969B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2007 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Jan 17, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9501
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Various methods and systems for identifying defect types on a wafer are provided. One computer-implemented method for identifying defect types on a wafer includes acquiring output of an inspection system for defects detected on a wafer. The output is acquired by different combinations of illumination and collection channels of the inspection system. The method also includes identifying defect types of the defects based on the output acquired by a set of the different combinations. The set of the different combinations is selected based on the defect types to be identified on the wafer and a wafer type of the wafer such that a different set of the different combinations of the illumination and collection channels is used for identifying different defect types on different wafer types.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.