Method of manufacturing component-embedded printed circuit board
US7730612B2 · kind B2 · utility
4Cited by
1References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2008 |
| Grant date | Jun 8, 2010 |
| Priority date | — |
| Expiry date | May 8, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49139
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first metal layer stacked over a first insulation layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.