Sung Yi
22Patents
5h-index
37Co-inventors
61Inventor score
Filing activity: Jan 23, 2008 → Nov 15, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8893380B2 | Method of manufacturing a chip embedded printed circuit board | Emerging Cross-Sectional Technologies | 35 | Active |
| US7663250B2 | Wafer level package and manufacturing method thereof | Electricity | 24 | Active |
| US8593595B2 | Color filter using surface plasmon and liquid crystal display device | Physics | 6 | Active |
| US8064215B2 | Semiconductor chip package and printed circuit board | Electricity | 6 | Active |
| US7886414B2 | Method of manufacturing capacitor-embedded PCB | Emerging Cross-Sectional Technologies | 5 | Active |
| US7727877B2 | Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar | Electricity | 5 | Active |
| US8283768B2 | Wafer Level package for heat dissipation and method of manufacturing the same | Electricity | 4 | Active |
| US7632709B2 | Method of manufacturing wafer level package | Electricity | 4 | Active |
| US7730612B2 | Method of manufacturing component-embedded printed circuit board | Emerging Cross-Sectional Technologies | 4 | Active |
| US8026590B2 | Die package and method of manufacturing the same | Electricity | 4 | Active |
| US8552305B2 | Electronic component-embedded printed circuit board | Electricity | 3 | Active |
| US8110914B2 | Wafer level package with removable chip protecting layer | Electricity | 3 | Active |
| US8351215B2 | Method of manufacturing a chip embedded printed circuit board | Emerging Cross-Sectional Technologies | 2 | Active |
| US8558975B2 | Liquid crystal display device and method of fabricating the same | Physics | 2 | Active |
| US7992296B2 | PCB and manufacturing method thereof | Emerging Cross-Sectional Technologies | 2 | Active |
| US8379171B2 | Fringe field switching mode liquid crystal display device and method for fabricating the same | Physics | 1 | Active |
| US7982982B2 | Wafer level packaging image sensor module having lens actuator and method of manufacturing the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US8302270B2 | Method of manufacturing capacitor-embedded PCB | Emerging Cross-Sectional Technologies | 1 | Active |
| US9075269B2 | Array substrate and liquid crystal display device including the same | Physics | 1 | Active |
| US8943685B2 | Method of manufacturing a capacitor-embedded printed circuit board | Emerging Cross-Sectional Technologies | 0 | Active |
| US8779580B2 | Electronic component package and manufacturing method thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US8283251B2 | Method of manufacturing wafer level package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.