Method for making light emitting diode chip package
US7732233B2 · kind B2 · utility
6Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2009 |
| Grant date | Jun 8, 2010 |
| Priority date | — |
| Expiry date | Jun 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/858
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The LED chip package of the present invention uses a semiconductor substrate as package substrate, which improves heat dissipation. Also, the LED chip package is incorporated with a planarization structure, which renders the LED chip and the substrate a substantially planar surface, thereby making formation of a planar patterned conductive layer possible. Accordingly, serial/parallel electrical connections between light emitting diode chips can be easily implemented by virtue of the planar patterned conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.