Fabrication process for package with light emitting device on a sub-mount

US7732234B2 · kind B2 · utility

Assignee

• Hymite A/S · DK

Inventors

• Christoffer G. Greisen · Copenhagen, DK
• Matthias Heschel · Copenhagen, DK
• Lior Shiv · Yoqneam Illit, IL
• Steen Weichel · Copenhagen, DK

Key dates

• Filing date: Feb 15, 2007
• Grant date: Jun 8, 2010
• Expiry date: Dec 2, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857

Abstract

A method of fabricating a package with a light emitting device includes depositing a first metallization to form a conductive pad on which the light emitting device is to be mounted and to form one or more feed-through interconnections extending through a semiconductor material that supports the conductive pad. Subsequently, a second metallization is deposited to form a reflective surface for reflecting light, emitted by the light emitting device, through a lid of the package. Deposition of the second metallization is de-coupled from deposition of the first metallization.