Methods for producing improved epitaxial materials
US7732306B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2008 |
| Grant date | Jun 8, 2010 |
| Priority date | — |
| Expiry date | Nov 21, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02647
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention provides methods for fabricating substantially continuous layers of group III nitride semiconductor materials having low defect densities. The methods include epitaxial growth of nucleation layers on a base substrate, thermally treatment of said nucleation layer and epitaxial growth of a discontinuous masking layer. The methods outlined promote defect reduction through masking, annihilation and coalescence, therefore producing semiconductor structures with low defect densities. The invention can be applied to a wide range of semiconductor materials, both elemental semiconductors, e.g., combinations of Si (silicon) with strained Si (sSi) and/or Ge (germanium), and compound semiconductors, e.g., group II-VI and group III-V compound semiconductor materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.