Vapor chamber heat sink having a carbon nanotube fluid interface
US7732918B2 · kind B2 · utility
16Cited by
58References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2007 |
| Grant date | Jun 8, 2010 |
| Priority date | — |
| Expiry date | Jun 22, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/932
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An enhanced heat transposer comprised is of a vapor chamber. The surface of the vapor chamber that holds the fluid comprises an array of carbon nanotubes (CNTs) that are grown in a way that enables the fluid to come into maximum contact with the CNTs. The fluid evaporates in the sealed vapor chamber when it is in touch with a hot surface. The vapor comes in contact with a hollow pin-fin structure that provides additional surface area for vapor cooling and heat transfer. The condensed vapor then drops back into the fluid container, and the cycle continues.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.