Wire bonding apparatus
US7735707B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 13, 2007 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Jul 13, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01033
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wire bonding apparatus including a bonding arm provided at a tip end thereof with an ultrasonic horn that has a capillary at its tip end, wherein the bonding arm is provided therein with a pressure sensor that detects the pressing load applied by the capillary on a workpiece when bonding is executed. The bonding arm has a supporting point which is a thin-connecting portion and located at a height which is the same as the height of the center of gravity of a part formed by the capillary, ultrasonic horn body portion, ultrasonic vibrator, ultrasonic horn connecting portion, etc., and at a point where a balance between inertial mass including the capillary, ultrasonic horn body part, ultrasonic horn connecting portion, horn securing screws and pressure screws and inertial mass of the ultrasonic vibrator is maintained, when the bonding arm is turned about a bonding arm supporting shaft.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.