Method for mounting chip component and circuit board
US7735713B2 · kind B2 · utility
10Cited by
13References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2006 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Jul 19, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.