Akira Goshima
5Patents
3h-index
12Co-inventors
43Inventor score
Filing activity: Dec 7, 2005 → Jan 8, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7735713B2 | Method for mounting chip component and circuit board | Emerging Cross-Sectional Technologies | 10 | Active |
| US8179225B2 | Ceramic electronic component, manufacturing method of ceramic electronic component, and packaging method of ceramic electronic components | Emerging Cross-Sectional Technologies | 7 | Active |
| US7177138B2 | Chip-type electronic component | Electricity | 5 | Expired |
| US7751176B2 | Ceramic electronic component | Electricity | 3 | Active |
| US7799409B2 | Ceramic green sheet structure and method for manufacturing laminated ceramic electronic component | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.