Detachable edge ring for thermal processing support towers
US7736436B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2006 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Aug 17, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T117/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An edge ring for use in batch thermal processing of wafers supported on a vertical tower within a furnace. The edge rings are have a width approximately overlapping the periphery of the wafers and are detachably supported on the towers equally spaced between the wafer to reduce thermal edge effects. The edge rings have may have internal or external recesses to interlock with structures on or adjacent the fingers of the tower legs supporting the wafers or one or more steps formed on the lateral sides of the edge ring may slide over and then fall below a locking ledge associated with the support fingers. Preferably, the tower and edge ring and other parts of the furnace adjacent the hot zone are composed of silicon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.