Thin film microshells incorporating a getter layer
US7736929B1 · kind B1 · utility
23Cited by
31References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2007 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Jul 22, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0145
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Low temperature, multi-layered microshells for encapsulation of devices such as MEMS and microelectronics. The microshells may include a perforated pre-sealing layer, below which a sacrificial layer is accessed, and a sealing layer to close the perforation in the pre-sealing layer after the sacrificial material is removed. The pre-sealing layer includes a large surface area getter layer to remove contaminants from the space ultimately enclosed by the microshell to improve the pressure control and cleanliness of the microshell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.