Via including multiple electrical paths
US7737025B2 · kind B2 · utility
1Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2007 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Apr 22, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09827
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming an plurality of paths on a substrate includes drilling an opening for a via to a depth to expose a first pad and a second pad, lining the opening with a conductive material, and insulating a first portion of the lining in the opening from a second portion of the lining in the opening to form a first electrical path contacting the first pad and a second electrical path contacting the second pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.