Eric Palmer
9Patents
5h-index
10Co-inventors
56Inventor score
Filing activity: Dec 17, 2003 → May 17, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8093704B2 | Package on package using a bump-less build up layer (BBUL) package | Electricity | 63 | Active |
| US7183653B2 | Via including multiple electrical paths | Electricity | 54 | Expired |
| US8188594B2 | Input/output package architectures | Electricity | 51 | Active |
| US7705447B2 | Input/output package architectures, and methods of using same | Electricity | 16 | Active |
| US7275316B2 | Method of embedding passive component within via | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7952202B2 | Method of embedding passive component within via | Emerging Cross-Sectional Technologies | 4 | Active |
| US8487446B2 | Method of embedding passive component within via | Emerging Cross-Sectional Technologies | 1 | Active |
| US7737025B2 | Via including multiple electrical paths | Electricity | 1 | Active |
| US9960079B2 | Passive within via | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.