Horizontal row drivers for CMOS image sensor with tiling on three edges

US7737390B2 · kind B2 · utility

Assignee

• TOWER PARTNERS SEMICONDUCTOR CO., LTD. · IL

Inventors

• Erez Sarig · Migdal HaEmek, IL
• Raz Reshef · Nes Ziona, IL
• Shay Alfassi · Migdal HaEmek, IL
• David Cohen

Key dates

• Filing date: Jan 14, 2008
• Grant date: Jun 15, 2010
• Expiry date: Jan 14, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/18

Abstract

A large image sensor structure is created by tiling a plurality of image sensor dies, wherein each of the image sensor dies includes a pixel array that extends to three edges of the die, and control circuitry located along a fourth edge of the die. None of the control circuitry required to access the pixel array (e.g., none of the row driver circuitry) is located in the pixel array, thereby enabling consistent spacing of pixels across the pixel array. Because the pixel array of each image sensor die extends to three edges of the die, the pixel array of each image sensor die can abut up to three pixel arrays in other image sensor dies to form a large image sensor structure having 2×N tiled image sensor dies.