Contact for use in testing integrated circuits
US7737708B2 · kind B2 · utility
19Cited by
8References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 10, 2007 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Jan 13, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07371
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A contact for use in a contact set assembly. The contact spans a space which separates a lead of an integrated circuit to be tested and a pad of a load board interfacing with the tester. The contact construction provides electrical communication between integrated circuit lead and the load board pad. Included is an insulating lamina which comprises, in part, a contact. A conductive lamina overlies at least a portion of the insulating lamina. The laminar construction and size and shape of conductive traces applied to a ceramic lamina enable parameters of the contact to be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.