Support for acoustic resonator and corresponding integrated circuit
US7737804B2 · kind B2 · utility
3Cited by
23References
19Claims
0Family size
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Key dates
| Filing date | Aug 28, 2006 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Nov 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/0547
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An integrated circuit includes at least one interconnection level and an acoustic resonator provided with an active element and a support. The includes at least one bilayer assembly having a layer of high acoustic impedance material and a layer of low acoustic impedance material. The support further includes a protruding element arranged on a metallization level of the interconnection level, making it possible to produce an electrical contact between an interconnection level and the active element of the acoustic resonator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.