Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator
US7739876B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2006 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Oct 21, 2027 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2321/0212
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus including a socket having a socket body and a cavity within the socket body. The apparatus further including a thermoelectric cooler coupled to an in-substrate voltage regulator positioned within the cavity. A method including coupling a thermoelectric cooler to an in-substrate voltage regulator positioned within a cavity of a socket and electrically coupling the thermoelectric cooler to the socket using a contact of the socket. A system including an electronic appliance having a processor including an in-substrate voltage regulator positioned within a cavity of a socket coupled to the processor. The system further including a thermoelectric cooler positioned within the cavity and coupled to the in-substrate voltage regulator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.