David Chau
10Patents
5h-index
9Co-inventors
55Inventor score
Filing activity: Mar 26, 2003 → Jan 4, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7336487B1 | Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant | Electricity | 24 | Active |
| US6868898B2 | Heat pipe having an inner retaining wall for wicking components | Mechanical Engineering; Lighting; Heating | 13 | Expired |
| US7915081B2 | Flexible interconnect pattern on semiconductor package | Electricity | 6 | Active |
| US7211890B2 | Integrating thermoelectric elements into wafer for heat extraction | Electricity | 5 | Expired |
| US7739876B2 | Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator | Mechanical Engineering; Lighting; Heating | 5 | Active |
| US7560640B2 | Densely packed thermoelectric cooler | Electricity | 2 | Active |
| US8409924B2 | Flexible interconnect pattern on semiconductor package | Electricity | 2 | Active |
| US8227907B2 | Flexible interconnect pattern on semiconductor package | Electricity | 1 | Active |
| US7430870B2 | Localized microelectronic cooling | Electricity | 1 | Expired |
| US8518750B2 | Flexible interconnect pattern on semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.