Mold for manufacturing heat dissipation apparatus
US7740050B2 · kind B2 · utility
0Cited by
4References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 14, 2007 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Apr 6, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22D19/0018
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A mold (200) for manufacturing a heat dissipation apparatus (10) includes a movable mold (20) and a fixed mold (30) covering the movable mold. The heat dissipation apparatus includes a plurality of fins (12). One of the movable mold and the fixed mold includes an insert group (50). The insert group includes a plurality of separated inserts (51) stacked together. A plurality of compartments (513) are formed between adjacent inserts of the insert group for forming the fins of the heat dissipation apparatus when molten metal is injected into the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.