Adhesion assisting agent fitted metal foil, and printed wiring board using thereof
US7740936B2 · kind B2 · utility
6Cited by
9References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2005 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Jan 23, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2887
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 μm on a metal whose surface has a ten-point average roughness Rz of 2.0 μm or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.