Takako Ejiri
4Patents
2h-index
17Co-inventors
41Inventor score
Filing activity: Nov 10, 2005 → Apr 3, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7740936B2 | Adhesion assisting agent fitted metal foil, and printed wiring board using thereof | Emerging Cross-Sectional Technologies | 6 | Active |
| US8956732B2 | Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board | Emerging Cross-Sectional Technologies | 3 | Active |
| US8236906B2 | Polyamide-imide resin, process for production of polyamide resin, and curable resin composition | Chemistry; Metallurgy | 2 | Active |
| US11905412B2 | Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.