Electronic apparatus interconnect routing
US7741718B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2009 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Nov 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus are provided for routing interconnects of a dual-gate electronic device operating in a differential configuration. An electronic apparatus formed on a substrate is provided comprising a first interconnect (40, 42, 44) configured to couple to a first region of the substrate, a first gate (22, 24, 26, 28) coupled to the first interconnect and configured to receive a first differential input, a second interconnect (30, 32, 34, 36, 38) parallel to the first interconnect and configured to couple to a second region of the substrate, and a second gate (20) coupled to the second interconnect and configured to receive a second differential input. The first gate is parallel to the first interconnect, and the second gate is parallel to the second interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.