White LED package structure having a silicon substrate and method of making the same
US7741772B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2007 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Apr 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/851
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A white light emitting diode package structure having a silicon substrate is disclosed. The white light emitting diode package structure comprises a silicon substrate having a plurality of cup-structures thereon, one of a plurality of blue light emitting diodes is respectively disposed in each cup-structure, and a phosphor structure covering the silicon substrate and the cup-structures. The blue light emitting diodes have various wavelengths and the phosphor structure has a plurality of kinds of phosphor powders and a sealing material. Each kind of phosphor powder is able to convert blue light within a certain wavelength into yellow light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.