Method for producing an optoelectronic component

US7742677B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Franz Eberhard · Kilchberg, CH
• Uwe Strauss · Bad Abbach, DE
• Ulrich Zehnder · Regensburg, DE
• Andreas Weimar · Regensburg, DE
• Raimund Oberschmid · Sinzing, DE

Key dates

• Filing date: Jun 4, 2007
• Grant date: Jun 22, 2010
• Expiry date: May 5, 2028

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/947

Abstract

A method for producing an optoelectronic component is disclosed. The method includes the steps of providing a substrate, applying a semiconductor layer sequence to the substrate, applying at least two current expansion layers to the semiconductor layer sequence, applying and patterning a mask layer, patterning the second current expansion layer by means of an etching process during which sidewalls of the mask layer are undercut, patterning the first current expansion layer by means of an etching process during which the sidewalls of the mask layer are undercut at least to a lesser extent than during the patterning of the second current expansion layer, and removing the mask layer.