Process of fabricating a circuit board
US7743494B2 · kind B2 · utility
2Cited by
12References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2008 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Jan 11, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening, and electrodepositing a third insulating material on the exposed edge of the first electrically conductive core. A circuit board fabricated using the process is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.